Specific Process Knowledge/Thin film deposition/Deposition of Aluminium: Difference between revisions
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===Deposition of Aluminium=== | |||
Aluminium can be deposited by e-beam evaporation, by sputter and by thermal evaporation. In the chart below you can compare the different methods on the different deposition equipment. | Aluminium can be deposited by e-beam evaporation, by sputter and by thermal evaporation. In the chart below you can compare the different methods on the different deposition equipment. | ||
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! Batch size | |||
| | | | ||
*Up to 1x4" wafers | *Up to 1x4" wafers | ||
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*6x6" wafers | *6x6" wafers | ||
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| Pre-clean | |-style="background:LightGrey; color:black" | ||
! Pre-clean | |||
|RF Ar clean | |RF Ar clean | ||
|RF Ar clean | |RF Ar clean | ||
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|RF Ar clean | |RF Ar clean | ||
|- | |- | ||
| Layer thickness | |-style="background:WhiteSmoke; color:black" | ||
! Layer thickness | |||
|10Å to 1µm | |10Å to 1µm | ||
|10Å to 1 µm | |10Å to 1 µm | ||
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|10Å to 0.5 µm (this uses all Al in the boat) | |10Å to 0.5 µm (this uses all Al in the boat) | ||
|- | |- | ||
| Deposition rate | |-style="background:LightGrey; color:black" | ||
! Deposition rate | |||
|2Å/s to 15Å/s | |2Å/s to 15Å/s | ||
|10Å/s to 15Å/s | |10Å/s to 15Å/s | ||