Specific Process Knowledge/Thin film deposition/Deposition of Silver: Difference between revisions
No edit summary |
No edit summary |
||
| Line 52: | Line 52: | ||
|1Å/s to 10 Å/s | |1Å/s to 10 Å/s | ||
|About 1Å/s | |About 1Å/s | ||
| | |Dependent on [[/Sputter rates for Ag PVD co-sputter/evaporation|process parameters]]. | ||
|Depending on process paramterers (see logbook) | |Depending on process paramterers (see logbook) | ||
|- | |- | ||
Revision as of 13:08, 28 February 2013
Silver can be deposited by e-beam or thermal evaporation. In the chart below you can compare the different deposition equipment.
| E-beam evaporation (Alcatel) | Thermal evaporation (Wordentec) | E-beam evaporation (PVD co-sputter/evaporation) | Sputter evaporation (PVD co-sputter/evaporation) | Sputter evaporation (Wordentec) | |
|---|---|---|---|---|---|
| Batch size |
|
|
|
|
|
| Pre-clean | RF Ar clean | RF Ar clean | RF Ar clean | RF Ar clean | RF Ar clean |
| Layer thickness | 10Å to 1µm | 10Å to 0.5µm (0.5µm not on all wafers) | 10Å to 1000Å | 10Å to about 5000Å | 10Å to about 3000Å |
| Deposition rate | 2Å/s to 15Å/s | 1Å/s to 10 Å/s | About 1Å/s | Dependent on process parameters. | Depending on process paramterers (see logbook) |
Thermal deposition of Silver - Process settings for thermal deposition of Silver in Wordentec