Specific Process Knowledge/Thin film deposition/Deposition of Silver: Difference between revisions
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! Thermal evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ! Thermal evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ||
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Multisource PVD|PVD co-sputter/evaporation]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Multisource PVD|PVD co-sputter/evaporation]]) | ||
! Sputter evaporation ([[Specific Process Knowledge/Thin film deposition/Multisource PVD|PVD co-sputter/evaporation]]) | |||
! Sputter evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ! Sputter evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ||
| Line 22: | Line 23: | ||
*12x4" wafers or | *12x4" wafers or | ||
*12x2" wafers | *12x2" wafers | ||
| | |||
*4x6" wafers or | |||
*12x4" wafers or | |||
*12x2" wafers | |||
| | | | ||
*6x6" wafers or | *6x6" wafers or | ||
| Line 32: | Line 38: | ||
|RF Ar clean | |RF Ar clean | ||
|RF Ar clean | |RF Ar clean | ||
|RF Ar clean | |||
|- | |- | ||
| Layer thickness | | Layer thickness | ||
| Line 37: | Line 45: | ||
|10Å to 0.5µm (0.5µm not on all wafers) | |10Å to 0.5µm (0.5µm not on all wafers) | ||
|10Å to 1000Å | |10Å to 1000Å | ||
|10Å to about | |10Å to about 5000Å | ||
|10Å to about 3000Å | |||
|- | |- | ||
| Deposition rate | | Deposition rate | ||
| Line 43: | Line 52: | ||
|1Å/s to 10 Å/s | |1Å/s to 10 Å/s | ||
|About 1Å/s | |About 1Å/s | ||
|Depending on process paramterers | |||
|Depending on process paramterers (see logbook) | |Depending on process paramterers (see logbook) | ||
|- | |- | ||
Revision as of 13:07, 28 February 2013
Silver can be deposited by e-beam or thermal evaporation. In the chart below you can compare the different deposition equipment.
| E-beam evaporation (Alcatel) | Thermal evaporation (Wordentec) | E-beam evaporation (PVD co-sputter/evaporation) | Sputter evaporation (PVD co-sputter/evaporation) | Sputter evaporation (Wordentec) | |
|---|---|---|---|---|---|
| Batch size |
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| Pre-clean | RF Ar clean | RF Ar clean | RF Ar clean | RF Ar clean | RF Ar clean |
| Layer thickness | 10Å to 1µm | 10Å to 0.5µm (0.5µm not on all wafers) | 10Å to 1000Å | 10Å to about 5000Å | 10Å to about 3000Å |
| Deposition rate | 2Å/s to 15Å/s | 1Å/s to 10 Å/s | About 1Å/s | Depending on process paramterers | Depending on process paramterers (see logbook) |
Thermal deposition of Silver - Process settings for thermal deposition of Silver in Wordentec