Specific Process Knowledge/Thin film deposition: Difference between revisions

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|[[/Deposition of Aluminium|13 Al Aluminium]]
|[[/Deposition of Aluminium|13 Al Aluminium]]
|[[/Deposition of Silicon|14 Si Silicon]]
|[[/Deposition of Silicon|14 Si Silicon]]
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|4  
|4  
|[[/Deposition of Titanium|22 Ti Titanium]]
|[[/Deposition of Titanium|22 Ti Titanium]]
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|[[/Deposition of Chromium|24 Cr Chromium]]
|[[/Deposition of Chromium|24 Cr Chromium]]
|[[/Deposition of Nickel|28 Ni Nickel]]
|[[/Deposition of Nickel|28 Ni Nickel]]
|[[/Deposition of Copper|29 Cu Copper]]
|[[/Deposition of Copper|29 Cu Copper]]
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|[[/Deposition of Palladium|46 Pd Palladium]]
|[[/Deposition of Palladium|46 Pd Palladium]]
|[[/Deposition of Silver|47 Ag Silver]]
|[[/Deposition of Silver|47 Ag Silver]]
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|[[/Deposition of Tin|50 Sn Tin]]
|[[/Deposition of Tin|50 Sn Tin]]
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|[[/Deposition of Tantalum|73 Ta Tantalum]]
|[[/Deposition of Tantalum|73 Ta Tantalum]]
|[[/Deposition of Tungsten|74 W Tungsten]]
|[[/Deposition of Tungsten|74 W Tungsten]]
|[[/Deposition of Platinum|78 Pt Platinum]]
|[[/Deposition of Platinum|78 Pt Platinum]]
|[[/Deposition of Gold|79 Au Gold]]
|[[/Deposition of Gold|79 Au Gold]]
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Revision as of 13:57, 3 December 2007

Choose material to deposit

Metals/elements

Period/Group

IVB VB VIB VIIIB IB IIIA IVA
3 . . . . . 13 Al Aluminium 14 Si Silicon
4 22 Ti Titanium . 24 Cr Chromium 28 Ni Nickel 29 Cu Copper . .
5 . . . 46 Pd Palladium 47 Ag Silver . 50 Sn Tin
6 . 73 Ta Tantalum 74 W Tungsten 78 Pt Platinum 79 Au Gold . .

Alloys

Dielectrica

Polymers

  • SU8
  • Antistiction coating
  • Topas
  • PMMA


Choose deposition equipment

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