Specific Process Knowledge/Etch/RIE (Reactive Ion Etch): Difference between revisions

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 '''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/RIE_(Reactive_Ion_Etch) click here]'''
+'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Silicon_Nitride&action=submit click here]'''
 == Etching using the dry etch technique RIE (Reactive Ion Etch) ==
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 '''The user manuals, quality control procedures and results, user APVs, technical information and contact information can be found in LabManager:'''
+<!-- remember to remove the type of documents that are not present -->
 [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=18 RIE1 info page in LabManager],
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 |style="background:WhiteSmoke; color:black"|<b>RIE2</b>
 |-
-!style="background:silver; color:black;" align="center"|Purpose
+!style="background:silver; color:black;" align="center" width="60"|Purpose
 |style="background:LightGrey; color:black"|Dry etch of
 |style="background:WhiteSmoke; color:black"|
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 |-
 |}