Specific Process Knowledge/Lithography: Difference between revisions
| Line 66: | Line 66: | ||
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*DUV sensitive | *DUV sensitive | ||
** | **KSF M230Y | ||
**KSF M35G | |||
| | | | ||
*E-beam sensitive | *E-beam sensitive | ||
| Line 120: | Line 121: | ||
*150 mm wafers | *150 mm wafers | ||
| | | | ||
*100 mm wafers | *100 mm wafers | ||
*150 mm wafers | *150 mm wafers | ||
*200 mm wafers | |||
| | | | ||
We have cassettes that fit to | We have cassettes that fit to | ||