Specific Process Knowledge/Etch/Etching of Silicon: Difference between revisions
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*As RIE but better for high aspect ratio etching and deep etches (higher etch rate) | *As RIE but better for high aspect ratio etching and deep etches (higher etch rate) | ||
*Good selectivity to photoresist | *Good selectivity to photoresist | ||
*The ASE is dedicated to polymer etch, which can affect the Si etch stability. | |||
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* | *This is dedicated to metal etch | ||
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*Primarily for pure physical etch by sputtering with Ar-ions | *Primarily for pure physical etch by sputtering with Ar-ions | ||