Specific Process Knowledge/Characterization/Sample imaging: Difference between revisions
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![[Specific_Process_Knowledge/Characterization/SEM:_Scanning_Electron_Microscopy|SEM]] | ![[Specific_Process_Knowledge/Characterization/SEM:_Scanning_Electron_Microscopy|SEM]] | ||
![[Specific_Process_Knowledge/Characterization/AFM:_Atomic_Force_Microscopy|AFM]] | ![[Specific_Process_Knowledge/Characterization/AFM:_Atomic_Force_Microscopy|AFM]] | ||
![[Specific_Process_Knowledge/Characterization/Profiler#Dektak_XTA_new_stylus_profiler|Stylus profiler ( | ![[Specific_Process_Knowledge/Characterization/Profiler#Dektak_XTA_new_stylus_profiler|Stylus profiler (Dektak)]] | ||
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|1-20 nm | |1-20 nm | ||
depends on what SEM you use | |||
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|Electrons | |Electrons | ||
|Forces | |Forces | ||
| | |Contact | ||
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:(not possible to inspect entire wafer in JEOL SEM) | :(not possible to inspect entire wafer in JEOL SEM) | ||
*One 150 mm wafer | *One 150 mm wafer | ||
:only Zeiss, LEO and FEI | :(only Zeiss, LEO and FEI, not possible to inspect entire wafer) | ||
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*One small sample | *One small sample | ||