Jump to content

Specific Process Knowledge/Etch/Etching of Silicon: Difference between revisions

BGE (talk | contribs)
BGE (talk | contribs)
Line 258: Line 258:
*
*
|-
|-
|-
|-style="background:LightGrey; color:black"
!Resist thickness range
|
*~0.5µm to 20µm?
|
*~50nm to 2µm?
|
*~30nm to 0.5 µm
|
*~20nm to 10µm?
|
*?nm - ?µm
|-
|-
|-style="background:WhiteSmoke; color:black"
!Typical exposure time
|
2s-30s pr. wafer
|
?-? pr. ?
|
?-? pr. µm2
|
? pr. wafer
|
? pr. µm2
|-


|-
|-