Specific Process Knowledge/Etch/DRIE-Pegasus/processA: Difference between revisions
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=== Results === | === Results: Optical images === | ||
<gallery caption="Optical images of the C01548 batch that is processed 10:05 mins." widths="250" heights="200" perrow="3"> | <gallery caption="Optical images of the C01548 batch that is processed 10:05 mins." widths="250" heights="200" perrow="3"> | ||
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image:C01549.04-A.jpg|Wafer C01549.04: 35 % exposed area | image:C01549.04-A.jpg|Wafer C01549.04: 35 % exposed area | ||
image:C01549.04-B.jpg|Wafer C01549.05: 35 % exposed area (close-up) | image:C01549.04-B.jpg|Wafer C01549.05: 35 % exposed area (close-up) | ||
It is clear that | |||
</gallery> | </gallery> | ||