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Specific Process Knowledge/Etch/DRIE-Pegasus/processA: Difference between revisions

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Bureaucrats, danchip, Administrators
1,918 edits
Jml (talk | contribs)
Bureaucrats, danchip, Administrators
1,918 edits
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image:C01549.02-A.jpg|Wafer C01549.02: 10 % exposed area
image:C01549.02-A.jpg|Wafer C01549.02: 10 % exposed area
image:C01549.03.jpg|Wafer C01549.03: 20 % exposed area
image:C01549.03.jpg|Wafer C01549.03: 20 % exposed area
image:C01548.04-A.jpg|Wafer C01549.04: 35 % exposed area
image:C01549.04-A.jpg|Wafer C01549.04: 35 % exposed area
image:C01548.04-B.jpg|Wafer C01549.05: 35 % exposed area (close-up)
image:C01549.04-B.jpg|Wafer C01549.05: 35 % exposed area (close-up)


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