Specific Process Knowledge/Back-end processing: Difference between revisions

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*Wire bonder
*Wire bonder
*Anodic bonder
*Wafer scriber
*Wafer scriber
*Saw
*Saw
*Polishing machine
*Polishing machine

Revision as of 15:18, 4 October 2007

Choose an equipment

  • Wire bonder
  • Wafer scriber
  • Saw
  • Polishing machine
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