Specific Process Knowledge/Etch/Etching of Silicon: Difference between revisions
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*Can etch isotropic and anisotropic depending on the process parameters | *Can etch isotropic and anisotropic depending on the process parameters | ||
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*State-of-the-art dry silicon etcher with atmospheric cassette loader | |||
*Extremely high etch rate and advanced processing options | |||
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*As RIE but better for high aspect ratio etching and deep etches (higher etch rate) | *As RIE but better for high aspect ratio etching and deep etches (higher etch rate) | ||
*Good selectivity to photoresist | *Good selectivity to photoresist | ||
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*Primarily for pure physical etch by sputtering with Ar-ions | |||
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