Specific Process Knowledge/Lithography: Difference between revisions
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*E-beam sensitive | *E-beam sensitive | ||
**ZEP502A | **ZEP502A (positive) | ||
**HSQ (negative) | |||
**SU8 | **SU8 | ||
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*~50nm to 2µm? | *~50nm to 2µm? | ||
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*~ | *~30nm to 0.5 µm | ||
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*~20nm to 10µm? | *~20nm to 10µm? | ||
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*<nowiki>#</nowiki> 150 mm wafers | *<nowiki>#</nowiki> 150 mm wafers | ||
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*<nowiki>#</nowiki> small samples | We have cassettes that fit to | ||
*<nowiki>#</nowiki> 50 mm | *<nowiki>#</nowiki> 4 small samples (20mm, 12mm, 8mm, 4mm) | ||
*<nowiki>#</nowiki> 100 mm | *<nowiki>#</nowiki> 6 wafers of 50 mm in size | ||
*<nowiki>#</nowiki> 150 mm | *<nowiki>#</nowiki> 2 wafers of 100 mm in size | ||
*<nowiki>#</nowiki> 1 wafer of 150 mm in size | |||
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*<nowiki>#</nowiki> small samples | *<nowiki>#</nowiki> small samples | ||
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*Allowed material 3 | *Allowed material 3 | ||
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* | *Si, SiO2, III-V materials | ||
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*Allowed material 1 | *Allowed material 1 | ||