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Specific Process Knowledge/Etch/DRIE-Pegasus/processB: Difference between revisions

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Bureaucrats, danchip, Administrators
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Jml (talk | contribs)
Bureaucrats, danchip, Administrators
1,918 edits
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|+ '''Wafers'''
|+ '''Wafers'''
|-
|-
! width="100" |Wafer number
! width="70" |Wafer number
! width="100" |Mask
! width="70" |Mask
! width="100" |Process B duration
! width="70" |Process B duration
|-
|-
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| 2
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|+ '''Wafers'''
|+ '''Wafers'''
|-
|-
! width="100" |Wafer number
! width="70" |Wafer number
! width="100" |Mask
! width="70" |Mask
! width="100" |Process B duration
! width="70" |Process B duration
|-
|-
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| 11
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<gallery caption="The results of process B after 17 and 34 cycles of etching"  widths="500" heights="350" perrow="2">
<gallery caption="The results of process B after 17 and 34 cycles of etching"  widths="400" heights="250" perrow="2">
image:Travkatesting1a.jpg|  
image:Travkatesting1a.jpg|  
image:Travkatesting1b.jpg|The 60 nm trenches
image:Travkatesting1b.jpg|The 60 nm trenches
</gallery>
</gallery>
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