Specific Process Knowledge/Etch/DRIE-Pegasus/processB: Difference between revisions
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Perhaps the most commonly occuring question posed by users of the dry etch tools is something like ' I want to etch my trenches down to a depth of 40 microns, how long should I etch?'. The answer is that it depends on the width of the trench and on the etch load of your design (that is how many percent of the wafer it etched). | Perhaps the most commonly occuring question posed by users of the dry etch tools is something like ' I want to etch my trenches down to a depth of 40 microns, how long should I etch?'. The answer is that it depends on the width of the trench and on the etch load of your design (that is how many percent of the wafer it etched). | ||
An experiment has been set up to investigate the etched depth of a number of different trenches (with widths ranging from 2 microns to 300 microns) as a function of etch load | An experiment has been set up to investigate the etched depth of a number of different trenches (with widths ranging from 2 microns to 300 microns) as a function of etch load (the exposed area ranges from 5 % to 65 %) | ||
=== Results === | === Results === | ||