Specific Process Knowledge/Thin film deposition: Difference between revisions
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=== Metals === | === Metals === | ||
*Aluminium | *Aluminium | ||
*Nickel | |||
*Titanium | |||
*Gold | *Gold | ||
=== Polymers === | === Polymers === | ||
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=== Other materials === | === Other materials === | ||
*Silicon Nitride | |||
*Silicon Oxide | |||
*PolySilicon | |||
Revision as of 10:34, 11 October 2007
Choose material to deposit
Metals
- Aluminium
- Nickel
- Titanium
- Gold
Polymers
- SU8
- Antistiction coating
Other materials
- Silicon Nitride
- Silicon Oxide
- PolySilicon
Choose deposition equipment
- Alcatel - E-beam evaporator and sputter tool
- Leybold - E-beam evaporator and multiple wafer tool
- Wordentec - Metal evaporator and ?
- Hummer - Gold sputtering system
- PECVD - Plasma Enhanced Chemical Vapor deposition
- B2 Furnace LPCVD Nitride - Deposition of silicon nitrid
- B3 Furnace LPCVD TEOS - Deposition of silicon oxide
- B4 Furnace LPCVD PolySilicon - Deposition of polysilicon
- MVD - Molecular Vapor Deposition