Specific Process Knowledge/Thin film deposition: Difference between revisions
No edit summary |
No edit summary |
||
| Line 23: | Line 23: | ||
*Leybold - ''E-beam evaporator and multiple wafer tool'' | *Leybold - ''E-beam evaporator and multiple wafer tool'' | ||
*Wordentec - ''Metal evaporator and ?'' | *Wordentec - ''Metal evaporator and ?'' | ||
*Hummer - ''Gold sputtering system'' | |||
*PECVD - ''Plasma Enhanced Chemical Vapor deposition'' | *PECVD - ''Plasma Enhanced Chemical Vapor deposition'' | ||
*B2 Furnace LPCVD Nitride - ''Deposition of silicon nitrid'' | *B2 Furnace LPCVD Nitride - ''Deposition of silicon nitrid'' | ||
Revision as of 11:56, 2 October 2007
Choose material to deposit
Metals
- Aluminium
- Gold
- Titanium
- Nickel
Polymers
- SU8
- Antistiction coating
Other materials
- PolySilicon
- Silicon Oxide
- Silicon Nitride
Choose deposition equipment
- Alcatel - E-beam evaporator and sputter tool
- Leybold - E-beam evaporator and multiple wafer tool
- Wordentec - Metal evaporator and ?
- Hummer - Gold sputtering system
- PECVD - Plasma Enhanced Chemical Vapor deposition
- B2 Furnace LPCVD Nitride - Deposition of silicon nitrid
- B3 Furnace LPCVD TEOS - Deposition of silicon oxide
- B4 Furnace LPCVD PolySilicon - Deposition of polysilicon
- MVD - Molecular Vapor Deposition