Specific Process Knowledge/Thin film deposition: Difference between revisions
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*Leybold - ''E-beam evaporator and multiple wafer tool'' | *Leybold - ''E-beam evaporator and multiple wafer tool'' | ||
*Wordentec - ''Metal evaporator and ?'' | *Wordentec - ''Metal evaporator and ?'' | ||
*Hummer - ''Gold sputtering system'' | |||
*PECVD - ''Plasma Enhanced Chemical Vapor deposition'' | *PECVD - ''Plasma Enhanced Chemical Vapor deposition'' | ||
*B2 Furnace LPCVD Nitride - ''Deposition of silicon nitrid'' | *B2 Furnace LPCVD Nitride - ''Deposition of silicon nitrid'' | ||