Specific Process Knowledge/Etch/Wet Silicon Oxide Etch (BHF): Difference between revisions
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In plastic beaker or PP-bath in the fume hood in cleanroom 2: | In plastic beaker or PP-bath in the fume hood in cleanroom 2: | ||
*All materials | *All materials | ||
BHF-bath in | BHF-bath in cleanroom 3: | ||
*Silicon | *Silicon | ||
*Silicon nitrides | *Silicon nitrides | ||
*Silicon oxides | *Silicon oxides | ||
*Photoresist | *Photoresist | ||
BHF-bath in the RCA bench: | |||
*Only wafers with phosphor glass or boron glass that comes directly from one of the furnaces in stack A. | |||
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In plastic beaker or PP-bath in the fume hood in cleanroom 2: | In plastic beaker or PP-bath in the fume hood in cleanroom 2: | ||
*All materials | *All materials | ||
In RCA bench: | In RCA bench: | ||
*Only | *Only wafers that are being RCA cleaned | ||
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In plastic beaker in the fume hood in cleanroom 2: | In plastic beaker in the fume hood in cleanroom 2: | ||