Specific Process Knowledge/Etch/Wet Silicon Oxide Etch (BHF): Difference between revisions
| Line 74: | Line 74: | ||
|'''Batch size''' | |'''Batch size''' | ||
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Plastic beaker: | |||
*1-5 wafer of 4" at a time | *1-5 wafer of 4" at a time | ||
PP-bath: | PP-bath: | ||
| Line 82: | Line 81: | ||
*1-25 wafers of 4" at a time | *1-25 wafers of 4" at a time | ||
| | | | ||
Plastic beaker: | |||
*1-5 wafer of 4" at a time | *1-5 wafer of 4" at a time | ||
PP-bath: | PP-bath: | ||
| Line 101: | Line 100: | ||
|'''Allowed materials''' | |'''Allowed materials''' | ||
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In beaker or PP-bath in the fume hood in cleanroom 2: | In plastic beaker or PP-bath in the fume hood in cleanroom 2: | ||
*All materials | *All materials | ||
BHF-bath in cleanroom3: | BHF-bath in cleanroom3: | ||
| Line 109: | Line 108: | ||
*Photoresist | *Photoresist | ||
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In beaker or PP-bath in the fume hood in cleanroom 2: | In plastic beaker or PP-bath in the fume hood in cleanroom 2: | ||
*All materials | *All materials | ||
In RCA bench: | In RCA bench: | ||