Specific Process Knowledge/Etch/DRIE-Pegasus: Difference between revisions
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== Additional information == | == Additional information == | ||
'''Important information''' | |||
In August 2011 we introduced a new set of rules regarding the loading of wafers. In you were trained prior to this, you can find more information | |||
[[Specific_Process_Knowledge/Etch/DRIE-Pegasus/Waferloading|here]]. | |||
'''Acceptance test''' | |||
The instrument was opened for users in April 2010 when the acceptance test was signed. This was based on the performance of five standard recipes (A, B, C, D and SOI) that are further examined below. The acceptance test report is found [[Media:Pegasus_AcceptanceTest.pdf|here]]. | |||
'''Material from SPTS''' | '''Material from SPTS''' | ||