Specific Process Knowledge/Thin film deposition: Difference between revisions
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=== Polymers === | === Polymers === | ||
*SU8 | *SU8 | ||
*Antistiction coating | |||
=== Other materials === | === Other materials === | ||
Revision as of 11:55, 2 October 2007
Choose material to deposit
Metals
- Aluminium
- Gold
- Titanium
- Nickel
Polymers
- SU8
- Antistiction coating
Other materials
- PolySilicon
- Silicon Oxide
- Silicon Nitride
Choose deposition equipment
- Alcatel - E-beam evaporator and sputter tool
- Leybold - E-beam evaporator and multiple wafer tool
- Wordentec - Metal evaporator and ?
- PECVD - Plasma Enhanced Chemical Vapor deposition
- B2 Furnace LPCVD Nitride - Deposition of silicon nitrid
- B3 Furnace LPCVD TEOS - Deposition of silicon oxide
- B4 Furnace LPCVD PolySilicon - Deposition of polysilicon
- MVD - Molecular Vapor Deposition