Specific Process Knowledge/Characterization/Four-Point Probe: Difference between revisions

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'''[http://www.labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=163 Four point probe]'''
'''[http://www.labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=163 Four point probe]'''


==Overview of the performance of the boron pre-dep furnace and some process related parameters==
==Overview of the performance of the Four-Point Probe and some process related parameters==


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!style="background:silver; color:black;" align="center"|Purpose  
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|style="background:LightGrey; color:black"|Doping of boron
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Revision as of 10:48, 29 November 2012

Four-Point Probe

The Four-Point Probe is a Veeco FPP-5000 for I/V measurement. The main purpose it to measure resistance and resistivity on a 4" silicon wafer. But can also be used to find thickness of thin layers or test if is a N- or P-type wafer.

The wafer are pushed down on the four pins so a measurement is performed. It works only for 4" wafers because a special holder is need.

Four point probe: positioned in cleanroom 4

The user manual,technical information and contact information can be found in LabManager:

Four point probe

Overview of the performance of the Four-Point Probe and some process related parameters

Purpose
Performance

Look at the process knowlege

Process parameter range Process Temperature
  • 900-1150 oC
Process pressure
  • 1 atm
Gasses on the system
  • Ar, N2
Substrates Batch size
  • 1-30 4" wafer (or 2" wafers) per run
Substrate material allowed