Specific Process Knowledge/Thermal Process/C4 Aluminium Anneal furnace: Difference between revisions
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==C4 | ==C4 Aluminium Anneal furnace== | ||
[[Image:C4helstak.jpg |thumb|300x300px|C4 Furnace Aluminium Anneal: positioned in cleanroom 2]] | [[Image:C4helstak.jpg |thumb|300x300px|C4 Furnace Aluminium Anneal: positioned in cleanroom 2]] | ||
C4 | The C4 Aluminium Anneal furnace is a Tempress horizontal furnace for annealing of silicon wafers with aluminium. | ||
This furnace is the lowest of the furnace tubes in the furnace C-stack positioned in cleanroom 2. In this furnace it is allowed to enter wafers that contains aluminium. Check the [http://www.labmanager.danchip.dtu.dk/view_binary.php?fileId=1250 cross contamination chart | This furnace is the lowest of the furnace tubes in the furnace C-stack positioned in cleanroom 2. In this furnace it is allowed to enter wafers that contains aluminium. Check the [http://www.labmanager.danchip.dtu.dk/view_binary.php?fileId=1250 cross contamination chart]. | ||
'''The user manual | '''The user manual, technical information and contact information can be found in LabManager:''' | ||
'''[http://www.labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=90 Furnace C4: Aluminium Anneal]''' | |||
==Process knowledge== | ==Process knowledge== |
Revision as of 11:48, 30 November 2012
C4 Aluminium Anneal furnace
The C4 Aluminium Anneal furnace is a Tempress horizontal furnace for annealing of silicon wafers with aluminium.
This furnace is the lowest of the furnace tubes in the furnace C-stack positioned in cleanroom 2. In this furnace it is allowed to enter wafers that contains aluminium. Check the cross contamination chart.
The user manual, technical information and contact information can be found in LabManager:
Process knowledge
- Annealing: look at the Annealing page
Purpose | Annealing | Annealing of wafers containing aluminium. |
---|---|---|
Performance | Film thickness | |
Process parameter range | Process Temperature |
|
Process pressure |
| |
Gas flows |
| |
Substrates | Batch size |
|
Substrate material allowed |
Silicon wafers with alluminium. Wafers are allowed after alluminium lift off or after alluminium etch and resiststrip in acetone |