Specific Process Knowledge/Thermal Process/A1 Bor Drive-in furnace: Difference between revisions
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==A1 Furnace Bor drive-in== | ==A1 Furnace Bor drive-in== | ||
[[Image:A1.JPG|thumb|300x300px|A1 | [[Image:A1.JPG|thumb|300x300px|A1 Bor drive-in furnace: positioned in cleanroom 2]] | ||
The A1 Furnace Bor drive-in is a Tempress horizontal furnace for oxidation of silicon wafers, annealing of the grown oxide, drive-in of boron after a pre-deposition and oxidation of the boron phase layer. Bor pre-deposition takes place in the A2 Furnace Bor pre-dep. The A1 furnace can also be used for drive in of boron which has been ion implanted. | The A1 Furnace Bor drive-in is a Tempress horizontal furnace for oxidation of silicon wafers, annealing of the grown oxide, drive-in of boron after a pre-deposition and oxidation of the boron phase layer. Bor pre-deposition takes place in the A2 Furnace Bor pre-dep. The A1 furnace can also be used for drive in of boron which has been ion implanted. |
Revision as of 09:00, 29 November 2012
A1 Furnace Bor drive-in
The A1 Furnace Bor drive-in is a Tempress horizontal furnace for oxidation of silicon wafers, annealing of the grown oxide, drive-in of boron after a pre-deposition and oxidation of the boron phase layer. Bor pre-deposition takes place in the A2 Furnace Bor pre-dep. The A1 furnace can also be used for drive in of boron which has been ion implanted.
A1 is the top furnace tube in the A-stack positioned in cleanroom 2. The A-stack together with the C2 Furnace Gate oxide are the cleanest of all furnaces in the cleanroom. Please be aware of which substrates that are allowed to enter this furnace. Check the cross contamination chart.
The user manual, quality control procedure and results, technical information and contact information can be found in LabManager:
Process knowledge
- Boron drive-in: look at the Dope with Boron page
- Oxidation: look at the Oxidation page
- Annealing: look at the Annealing page
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Oxidation:
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Performance | Film thickness |
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Process parameter range | Process Temperature |
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Process pressure |
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Gasses on the system |
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Substrates | Batch size |
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Substrate material allowed |
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