Specific Process Knowledge/Back-end processing: Difference between revisions
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== Choose an equipment == | == Choose an equipment == | ||
*[[/Wire Bonder|Wire | *[[/Die Bonders|Die Bonders]] | ||
*[[/Wire Bonder|Wire Bonders]] | |||
*[[/Wafer Scriber|Wafer Scriber]] | *[[/Wafer Scriber|Wafer Scriber]] | ||
*[[/Disco Saw|Disco Saw]] | *[[/Disco Saw|Disco Saw]] | ||
Revision as of 13:59, 6 May 2013
Choose an equipment
- Die Bonders
- Wire Bonders
- Wafer Scriber
- Disco Saw
- Polymer Injection Molder
- Polishing machine
- Laser Micromachining Tool
- Sandblasting (at DTU Nanotech). Sandblasting is a very fast way of structuring glass and can be used for e.g. making inlet holes in glass substrates for microfluidic devices