Specific Process Knowledge/Etch/DRIE-Pegasus/StandardRecipes: Difference between revisions

Revision as of 11:56, 26 November 2012

Overview of the standard processes: Processes A, B, C, D and SOI

The instrument was accepted on the basis of the performance of 5 processes. Below is a general comparison - to find more detailed information, go the web page for each process

**Standard processes on the DRIE-Pegasus**
Process name	Type	Purpose	Conditions during original runs				Best usage
Process name	Type	Purpose	Feature	Mask material	Etch load	Comments	Best usage
Process A	Bosch	Fast etch	80 µm trench	Photo resist	12-13 % on 6" wafer
Process B	Bosch	Fast etch	30 µm diameter via	Photo resist	12-13 % on 6" wafer

Equipment		Equipment 1	Equipment 2
Purpose		Purpose 1 Purpose 2	Purpose 1 Purpose 2 Purpose 3
Performance	Response 1	Performance range 1 Performance range 2	Performance range 1 Performance range 2 Performance range 3
Performance	Response 2	Performance range	Performance range
Process parameter range	Parameter 1	Range	Range
Process parameter range	Parameter 2	Range	Range
Substrates	Batch size	# small samples # 50 mm wafers # 100 mm wafers # 150 mm wafers	# small samples # 50 mm wafers # 100 mm wafers # 150 mm wafers
	Allowed materials	Allowed material 1 Allowed material 2	Allowed material 1 Allowed material 2 Allowed material 3

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 |-
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+!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment
+|style="background:WhiteSmoke; color:black"|<b>Equipment 1</b>
+|style="background:WhiteSmoke; color:black"|<b>Equipment 2</b>
+|-
+!style="background:silver; color:black;" align="center"|Purpose
+|style="background:LightGrey; color:black"|
+|style="background:WhiteSmoke; color:black"|
+*Purpose 1
+*Purpose 2
+|style="background:WhiteSmoke; color:black"|
+*Purpose 1
+*Purpose 2
+*Purpose 3
+|-
+!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance
+|style="background:LightGrey; color:black"|Response 1
+|style="background:WhiteSmoke; color:black"|
+*Performance range 1
+*Performance range 2
+|style="background:WhiteSmoke; color:black"|
+*Performance range 1
+*Performance range 2
+*Performance range 3
+|-
+|style="background:LightGrey; color:black"|Response 2
+|style="background:WhiteSmoke; color:black"|
+*Performance range
+|style="background:WhiteSmoke; color:black"|
+*Performance range
+|-
+!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range
+|style="background:LightGrey; color:black"|Parameter 1
+|style="background:WhiteSmoke; color:black"|
+*Range
+|style="background:WhiteSmoke; color:black"|
+*Range
+|-
+|style="background:LightGrey; color:black"|Parameter 2
+|style="background:WhiteSmoke; color:black"|
+*Range
+|style="background:WhiteSmoke; color:black"|
+*Range
+|-
+!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
+|style="background:LightGrey; color:black"|Batch size
+|style="background:WhiteSmoke; color:black"|
+*<nowiki>#</nowiki> small samples
+*<nowiki>#</nowiki> 50 mm wafers
+*<nowiki>#</nowiki> 100 mm wafers
+*<nowiki>#</nowiki> 150 mm wafers
+|style="background:WhiteSmoke; color:black"|
+*<nowiki>#</nowiki> small samples
+*<nowiki>#</nowiki> 50 mm wafers
+*<nowiki>#</nowiki> 100 mm wafers
+*<nowiki>#</nowiki> 150 mm wafers
+|-
+| style="background:LightGrey; color:black"|Allowed materials
+|style="background:WhiteSmoke; color:black"|
+*Allowed material 1
+*Allowed material 2
+|style="background:WhiteSmoke; color:black"|
+*Allowed material 1
+*Allowed material 2
+*Allowed material 3
+|-
 |}