Specific Process Knowledge/Etch/DRIE-Pegasus/Notation: Difference between revisions
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== How to read the SPTS notation on process recipes == | == How to read the SPTS notation on process recipes == | ||
To understand the SPTS short hand notation on process recipes look at two examples from the etch cycle of | To understand the SPTS short hand notation on process recipes look at two examples from the etch cycle of Step1 of the Process A shown in '''bold''' below: | ||
# The Platen power has the setting ''120 >> 140 (1.5s) 45 '' - it is to be interpreted as: | # The Platen power has the setting ''120 >> 140 (1.5s) 45 '' - it is to be interpreted as: | ||
## In the first 1.5 seconds of the every cycle the platen power has a value that is ramped (indicated by >>) from 120 W initially to 150 W in the end | ## In the first 1.5 seconds of the every cycle the platen power has a value that is ramped (indicated by >>) from 120 W initially to 150 W in the end | ||
| Line 36: | Line 36: | ||
|- | |- | ||
! Pressure (mtorr) | ! Pressure (mtorr) | ||
| 25 (1.5 s) 90 >> 150 | | '''25 (1.5 s) 90 >> 150''' | ||
| 25 | | 25 | ||
| 25 (1.5 s) 150 | | 25 (1.5 s) 150 | ||
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|- | |- | ||
! Platen power (W) | ! Platen power (W) | ||
| 120 >> 140 (1.5) 45 | | '''120 >> 140 (1.5) 45''' | ||
| 0 | | 0 | ||
| 140 (1.5) 45 | | 140 (1.5) 45 | ||
Revision as of 12:16, 26 November 2012
How to read the SPTS notation on process recipes
To understand the SPTS short hand notation on process recipes look at two examples from the etch cycle of Step1 of the Process A shown in bold below:
- The Platen power has the setting 120 >> 140 (1.5s) 45 - it is to be interpreted as:
- In the first 1.5 seconds of the every cycle the platen power has a value that is ramped (indicated by >>) from 120 W initially to 150 W in the end
- During the remainder of the cycle the platen power is kept constant at 45 W.
- The Pressure has the setting 25 (1.5 s) 90 >> 150 - it is to be interpreted as:
- In the first 1.5 seconds the pressure is constant at 25 mtorr.
- During the remainder of the cycle the pressure has i higher value that is ramped from 90 initially to 150 mtorr in the last etch cycle.
| Step 1 | Step 2 | |||
|---|---|---|---|---|
| Parameter | Etch | Dep | Etch | Dep |
| Gas flow (sccm) | SF6 350 (1.5 s) 550 | C4F8 200 | SF6 350 (1.5 s) 550 | C4F8 200 |
| Cycle time (secs) | 7.0 | 4.0 | 7.0 | 4.0 |
| Pressure (mtorr) | 25 (1.5 s) 90 >> 150 | 25 | 25 (1.5 s) 150 | 25 |
| Coil power (W) | 2800 | 2000 | 2800 | 2000 |
| Platen power (W) | 120 >> 140 (1.5) 45 | 0 | 140 (1.5) 45 | 0 |
| Cycles | 11 (keep fixed) | 44 (vary this) | ||
| Common | Temperature 20 degs, HBC 10 torr, Short funnel, with baffle & 5mm spacers | |||