Specific Process Knowledge/Etch/DRIE-Pegasus: Difference between revisions
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The DRIE Pegasus is a state-of-art silicon dry etcher that offers outstanding performance in terms of etch rate, uniformity etc. It uses the so-called Bosch process to achieve excellent control of the etched features. Click [[Specific_Process_Knowledge/Etch/DRIE-Pegasus/System-description|here]] for more fundamental information of the system. | The DRIE Pegasus is a state-of-art silicon dry etcher that offers outstanding performance in terms of etch rate, uniformity etc. It uses the so-called Bosch process to achieve excellent control of the etched features. Click [[Specific_Process_Knowledge/Etch/DRIE-Pegasus/System-description|here]] for more fundamental information of the system. | ||
The user manual, quality control procedure and the results may all be found on the [http://www.labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=265| DRIE | The user manual, quality control procedure and the results may all be found on the [http://www.labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=265| DRIE-Pegasus LabManager] page. | ||
In August 2011 we introduced a new set of rules regarding the loading of wafers. In you were trained prior to this, you can find more information | In August 2011 we introduced a new set of rules regarding the loading of wafers. In you were trained prior to this, you can find more information | ||