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[[Specific_Process_Knowledge/Etch/DRIE-Pegasus/Waferloading|here]].
[[Specific_Process_Knowledge/Etch/DRIE-Pegasus/Waferloading|here]].


 
The instrument was opened for users in April 2010 when the acceptance test was signed. This was based on the performance of five standard recipes (A, B, C, D and SOI). The acceptance test report is found [[Media:Pegasus_AcceptanceTest.pdf|here]].


== Process information ==
== Process information ==