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| | == Process information == |
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| = Important: New rules (as of August 2011) for using the Pegasus =
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| Until August 2011 processing at the Pegasus was complicated by frequent losses of wafers during transfer operations. It is evident that the instrument is much more susceptible to misalignments of the carousel than expected. A service engineer from SPTS has made a thorough realigning of the instrument that we hope will last a long time. We have therefore introduced a new set of rules that ''all users'' should be taught during a new training session mandatory for all users regardless of prior experience. The rules are:
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| <div style="float:center; border:thick solid blue;">
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| # All wafers must be processed using the MACS cassette loader. The ''only'' exceptions are bonded wafers and 150 mm wafers - see point 3. Batch recipes must be prepaired - even for single wafer trial runs.
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| # The backsides of the wafers must be absolutely clean: Wipe with IPA or blow dry the backside of every wafer.
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| # Loading bonded wafers (''only'' bonded wafers and 6" wafers) using the load lock must be done with utmost care avoiding to change the position of the carousel.
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| # Processing using the MACS may be done either manually or automatically.
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| Please contact Roy, Peter or Jonas to make a training session.
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| </div>
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| ==The Bosch process in the DRIE-Pegasus==
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| This section introduces the advanced Bosch process used at the Pegasus and the process options it offers.
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