Specific Process Knowledge/Etch/ASE (Advanced Silicon Etch): Difference between revisions
Appearance
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|style="background:LightGrey; color:black"|Dry etch of | |style="background:LightGrey; color:black"|Dry etch of | ||
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*Silicon | * Silicon | ||
* Polymers such as polyimide, PDMS, PMMA, BCB and resists | |||
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!style="background:silver; color:black" align="left" valign="top" rowspan="2"|Performance | !style="background:silver; color:black" align="left" valign="top" rowspan="2"|Performance | ||
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|style="background:LightGrey; color:black"|Gas flows | |style="background:LightGrey; color:black"|Gas flows | ||
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*SF< | *SF<sub>_6</sub>: 0-600 sccm | ||
*O< | *O<sub>_2</sub>: 0-100 sccm | ||
*C< | *C<sub>_4</sub>F<sub>_8</sub>: 0-300 sccm | ||
*Ar: 0-100 sccm | *Ar: 0-100 sccm | ||
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