Specific Process Knowledge/Thin film deposition/Deposition of Silicon: Difference between revisions
New page: PolySilicon can be sputtered in Alcatel and be deposited in the PolySilicon furnace. Tin can be deposited by e-beam evaporation. In the chart below you can compare the different depositio... |
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|2Å/s to 15Å/s | |2Å/s to 15Å/s | ||
|1Å/s to 5Å/s | |1Å/s to 5Å/s | ||
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== Sputtered Silicon in the Alcatel== | |||
{| border="1" cellspacing="0" cellpadding="4" | |||
!The parameter(s) changed | |||
!New value(s) | |||
!Deposition rate | |||
|- | |||
|Standard parameters | |||
|None | |||
| | |||
|- | |||
|Power | |||
|400W | |||
|3.8 Å/s | |||
|- | |- | ||
|} | |} | ||