Specific Process Knowledge/Characterization: Difference between revisions
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*[[Specific_Process_Knowledge/Characterization/Drop_Shape_Analyzer|Hydrophobicity measurement]] | *[[Specific_Process_Knowledge/Characterization/Drop_Shape_Analyzer|Hydrophobicity measurement]] | ||
*[[/Resistivity measurement|Resistivity measurement]] | *[[/Resistivity measurement|Resistivity measurement]] | ||
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*[[/Other electrical measurements|Other electrical measurements]] | *[[/Other electrical measurements|Other electrical measurements]] | ||
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== Choose equipment == | == Choose equipment == | ||
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*[[/Thickness Measurer|Thickness Measurer]] | *[[/Thickness Measurer|Thickness Measurer]] | ||
*[[/Probe station|Probe station]] | *[[/Probe station|Probe station]] | ||
Revision as of 13:51, 21 November 2012
Choose characterization topic (to find which tool to use)
- Sample imaging
- Topographic measurement
- Stress measurement
- Measurement of film thickness and optical constants
- Wafer thickness measurement
- Element analysis
- Hydrophobicity measurement
- Resistivity measurement