Specific Process Knowledge/Etch/Etching of Silicon/Si etch using ASE: Difference between revisions

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 === Deepetch ===
-The deepetch recipe is designed to etch features (with sizes 2 <math>\mu</math>m) in silicon down to a depth that ranges from some 50 microns to hundreds of microns. (If you need to etch less, use shallow or Nanoetches.) It is specified to etch a 50 µm wide trench down to a depth of 300 µm on a wafer that has a global/local etch density of 10%.
+The deepetch recipe is designed to etch features (with sizes 2 µm) in silicon down to a depth that ranges from some 50 microns to hundreds of microns. (If you need to etch less, use shallow or Nanoetches.) It is specified to etch a 50 µm wide trench down to a depth of 300 µm on a wafer that has a global/local etch density of 10%.
 The recipe is given below.