Specific Process Knowledge/Back-end processing: Difference between revisions
mNo edit summary |
|||
| Line 5: | Line 5: | ||
*[[/Disco Saw|Disco Saw]] | *[[/Disco Saw|Disco Saw]] | ||
*[[/Polymer Injection Molder|Polymer Injection Molder]] | *[[/Polymer Injection Molder|Polymer Injection Molder]] | ||
*[[Polishing machine]] | *[[/Polishing machine|Polishing machine]] | ||
*[[/Laser Micromachining Tool|Laser Micromachining Tool]] | *[[/Laser Micromachining Tool|Laser Micromachining Tool]] | ||
*[[Sandblasting|Sandblasting (at DTU Nanotech).]] Sandblasting is a very fast way of structuring glass and can be used for e.g. making inlet holes in glass substrates for microfluidic devices | *[[Sandblasting|Sandblasting (at DTU Nanotech).]] Sandblasting is a very fast way of structuring glass and can be used for e.g. making inlet holes in glass substrates for microfluidic devices | ||
Revision as of 10:57, 26 November 2012
Choose an equipment
- Wire Bonder
- Wafer Scriber
- Disco Saw
- Polymer Injection Molder
- Polishing machine
- Laser Micromachining Tool
- Sandblasting (at DTU Nanotech). Sandblasting is a very fast way of structuring glass and can be used for e.g. making inlet holes in glass substrates for microfluidic devices