Jump to content

Specific Process Knowledge/Wafer cleaning/RCA: Difference between revisions

BGE (talk | contribs)
No edit summary
BGE (talk | contribs)
Line 5: Line 5:
It consists of two solutions: RCA1 and RCA2 plus diluted HF. A crucial part of the RCA clean is the oxidation by H<sub>2</sub>O<sub>2</sub>. Therefore the life time of the RCA solutions are limited by the presence of the H<sub>2</sub>O<sub>2</sub> which is highly volatile at 70 <sup>o</sup>C.
It consists of two solutions: RCA1 and RCA2 plus diluted HF. A crucial part of the RCA clean is the oxidation by H<sub>2</sub>O<sub>2</sub>. Therefore the life time of the RCA solutions are limited by the presence of the H<sub>2</sub>O<sub>2</sub> which is highly volatile at 70 <sup>o</sup>C.


*The RCA1 contains: H<sub>2</sub>O, NH<sub>4</sub>OH and H<sub>2</sub>O<sub>2<sub> (5:1:1). It is used for removal of light organics, particles and metals. <br \>
*The RCA1 contains: H<sub>2</sub>O, NH<sub>4</sub>OH and H<sub>2</sub>O<sub>2</sub> (5:1:1). It is used for removal of light organics, particles and metals. <br \>
*The RCA2 contains: H<sub>2</sub>O, HCl and H<sub>2</sub>O<sub>2</sub> (5:1:1). It is used for removal of alkalis, metal hydroxides, and residual metals.
*The RCA2 contains: H<sub>2</sub>O, HCl and H<sub>2</sub>O<sub>2</sub> (5:1:1). It is used for removal of alkalis, metal hydroxides, and residual metals.