Specific Process Knowledge/Thin film deposition/Deposition of Copper: Difference between revisions
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Copper can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment. | |||
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== Deposition of Cu == | |||
Copper can be deposited by e-beam evaporation or sputtering . In the chart below you can compare the different deposition equipment. | |||
{| border="1" cellspacing="0" cellpadding="3" | {| border="1" cellspacing="0" cellpadding="3" | ||
|-style="background:silver; color:black" | |||
! | ! | ||
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]]) | ||
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Multisource PVD|PVD co-sputter/evaporation]]) | ! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Multisource PVD|PVD co-sputter/evaporation]]) | ||
|- | |- | ||
| Batch size | |-style="background:WhiteSmoke; color:black" | ||
! Batch size | |||
| | | | ||
*Up to 1x4" wafers | *Up to 1x4" wafers | ||
| Line 17: | Line 25: | ||
* 4x2" wafers | * 4x2" wafers | ||
|- | |- | ||
| Pre-clean | |-style="background:LightGrey; color:black" | ||
!Pre-clean | |||
|RF Ar clean | |RF Ar clean | ||
|RF Ar clean | |RF Ar clean | ||
|- | |- | ||
| Layer thickness | |-style="background:WhiteSmoke; color:black" | ||
!Layer thickness | |||
|10Å to 0.5µm | |10Å to 0.5µm | ||
| | | | ||
| Line 28: | Line 40: | ||
|- | |- | ||
| Deposition rate | |-style="background:LightGrey; color:black" | ||
! Deposition rate | |||
|2Å/s to 15Å/s | |2Å/s to 15Å/s | ||
| | | | ||