Specific Process Knowledge/Thin film deposition/Deposition of Copper: Difference between revisions
No edit summary |
No edit summary |
||
| Line 31: | Line 31: | ||
|2Å/s to 15Å/s | |2Å/s to 15Å/s | ||
| | | | ||
Depending on process parameters | Depending on [[Specific Process Knowledge/Thin film deposition/Multisource PVD/Cu|process parameters]] | ||
|- | |- | ||
|} | |} | ||