Specific Process Knowledge/Thin film deposition/Deposition of Copper: Difference between revisions
No edit summary |
No edit summary |
||
| Line 31: | Line 31: | ||
|2Å/s to 15Å/s | |2Å/s to 15Å/s | ||
| | | | ||
Depending on process | Depending on process parameters | ||
|- | |- | ||
|} | |} | ||
Revision as of 14:13, 1 October 2012
Copper can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.
| E-beam evaporation (Alcatel) | Sputter deposition (PVD co-sputter/evaporation) | |
|---|---|---|
| Batch size |
|
|
| Pre-clean | RF Ar clean | RF Ar clean |
| Layer thickness | 10Å to 0.5µm |
10Å to 0.5µm |
| Deposition rate | 2Å/s to 15Å/s |
Depending on process parameters |
Studies of Cu deposition processes
Roughness of Cu layers - Roughness of Cu layers deposited with Alcatel