Specific Process Knowledge/Thin film deposition: Difference between revisions

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=== Metals/elements ===  
=== Metals/elements ===  
{| border="1" cellspacing="0" cellpadding="7"
{| border="1" cellspacing="0" cellpadding="8"
|-
|-
|Period/Group
|IVB
|VB
|VIB
|VIIIB
|IB
|IIIA
|IVA
|-
|3
|
|
|
|
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|[[/Deposition of Aluminium|13 Al Aluminium]]
|[[/Deposition of Aluminium|13 Al Aluminium]]
|[[/Deposition of Silicon|14 Si Silicon]]
|[[/Deposition of Silicon|14 Si Silicon]]
|-  
|-
|4
|[[/Deposition of Titanium|22 Ti Titanium]]
|[[/Deposition of Titanium|22 Ti Titanium]]
|
|
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|
|
|-
|-
|5
|
|
|
|
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|[[/Deposition of Tin|50 Sn Tin]]
|[[/Deposition of Tin|50 Sn Tin]]
|-
|-
|6
|
|
|[[/Deposition of Tantalum|73 Ta Tantalum]]
|[[/Deposition of Tantalum|73 Ta Tantalum]]

Revision as of 09:51, 20 November 2007

Choose material to deposit

Metals/elements

Period/Group IVB VB VIB VIIIB IB IIIA IVA
3 13 Al Aluminium 14 Si Silicon
4 22 Ti Titanium 24 Cr Chromium 28 Ni Nickel 29 Cu Copper
5 46 Pd Palladium 47 Ag Silver 50 Sn Tin
6 73 Ta Tantalum 74 W Tungsten 78 Pt Platinum 79 Au Gold

Alloys

Dielectrica

Polymers

  • SU8
  • Antistiction coating
  • Topas
  • PMMA


Choose deposition equipment

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