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Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch: Difference between revisions

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== Development of switched nanoetch process ==
== Development of switched nanoetch process ==


On the basis of the pxnano2 recipe from the ASE we will try to make a similar Bosch process on the Pegasus. The substrates are 6" wafers with
On the basis of the pxnano2 recipe from the ASE we will try to make a similar Bosch process on the Pegasus.  


{| border="1" cellspacing="1" cellpadding="1" style="text-align:center;"
 
!Recipe
{| border="2" cellpadding="2" cellspacing="1" style="text-align:center;"
! colspan="2" align="center"| Nanobosch1
|+ '''Process parameters'''
! colspan="2" align="center"| Nanobosch2
! colspan="2" align="center"| Nanobosch3
! colspan="2" align="center"| Nanobosch4
! colspan="2" align="center"| Nanobosch5
|-
|-
! Cycle
! rowspan="2" width="100"| Recipe
! Etch
! rowspan="2" width="20"| Step
! Dep
! rowspan="2" width="20"| Temp.
! Etch
! colspan="6" | Deposition step
! Dep
! colspan="7" | Etch step
! Etch
! colspan="2" | Process observations
! Dep
! Etch
! Dep
! Etch
! Dep
|-
|-
!Cycle time (secs)
! width="40" | Time
! width="40" | Pressure
! width="40" | C<sub>4</sub>F<sub>8</sub>
! width="40" | SF<sub>6</sub>
! width="40" | O<sub>2</sub>
! width="40" | Coil
! width="40" | Time
! width="40" | [[Specific Process Knowledge/Etch/DRIE-Pegasus/Parameters| Pressure]]
! width="40" | C<sub>4</sub>F<sub>8</sub>
! width="40" | SF<sub>6</sub>
! width="40" | O<sub>2</sub>
! width="40" | Coil
! width="40" | Platen
! width="40" | [[Specific Process Knowledge/Etch/DRIE-Pegasus/Parameters| Hardware]]
! width="40" | Runs
|-
! nanobosch6
| A
| 20
| 2.5
| 10
| 50
| 0
| 0
| 500
| 5.0
| 10
| 40
| 60
| 5
| 5
| 350
| 30
| LF+B100
| [[Specific Process Knowledge/Etch/DRIE-Pegasus/nanobosch/nanobosch6 | Click]]
|-
! nb-1.0
| A
| 20
| 2.5
| 2.5
|
| 10
|
| 50
|
| 0
|
| 0
|
| 500
|
| 5.0
|
| 10
|
| 50
| 50
| 5
| 350
| 30
| LF+B100
| [[Specific Process Knowledge/Etch/DRIE-Pegasus/nanobosch/nb-1.0 | Click]]
|-
|-
!C<sub>4</sub>F<sub>8</sub> (sccm)
! nb-1.1
| A
| 20
| 2.5
| 10
| 50
| 0
| 0
| 500
| 5.0
| 10
| 50
| 50
| 50
| 50
|
| 5
|
| 350
|
! 50
|
| LF+B100
|
| [[Specific Process Knowledge/Etch/DRIE-Pegasus/nanobosch/nb-1.1 | Click]]
|
|
|
|-
|-
!SF<sub>6</sub> (sccm)
! nb-1.2
| A
| 20
| 2.5
| 10
| 50
| 50
| 0
| 0
|
|
|
|
|
|
|
|
|-
!O<sub>2</sub> (sccm)
| 5
| 0
| 0
|
|
|
|
|
|
|
|
|-
! Coil power (W)
| 350
| 500
| 500
|
| 5.0
|
| 10
|
| 50
|
| 50
|
| 5
|
! 500
|
| 50
|
| LF+B100
| [[Specific Process Knowledge/Etch/DRIE-Pegasus/nanobosch/nb-1.2 | Click]]
|-
|-
!Platen power (W)
! barcstrip
| A
| 20
|
|
|
|
|
|
| 30
| 30
| 4 (3@15)
| 0
| 0
| 0
|
| 40
|
! 200
|
| 20
|
| LF+B100
|
| [[Specific Process Knowledge/Etch/DRIE-Pegasus/nanobosch/barcstrip | Click]]
|
|
|
|-
|-
! Pressure (mtorr)
! nanobosch7
| A
| 20
| 2.5
| 10
| 10
| 50
| 0
| 0
| 500
| 5.0
| 10
| 10
|
| 40
|
| 60
|
| 5
|
| 350
|
| 30
|
| LF+B100
|
| [[Specific Process Knowledge/Etch/DRIE-Pegasus/nanobosch/nanobosch7 | Click]]
|
|-
|-
! Temperature (degs C)
 
| colspan="2" align="center"| 20
 
| colspan="2" align="center"|
| colspan="2" align="center"|
| colspan="2" align="center"|
| colspan="2" align="center"|
|-
! Duration
| colspan="2" align="center"| 60 cyc / 7:30
| colspan="2" align="center"|
| colspan="2" align="center"|
| colspan="2" align="center"|
| colspan="2" align="center"|
|-
! colspan="11" align="center"| Etch rates (nm/min)
|-
| Averages||.||.||.||.||.||.||.||.||.|
|-
| Std. Dev||.||.||.||.||.||.||.||.||.|
|-
! colspan="10" align="center"| Zep etch rate (nm/min)
|-
|  Averages||.||.||.||.||.||.||.||.||.|
|-
! colspan="10" align="center"| Sidewall angle (degrees)
|-
| Averages||.||.||.||.||.||.||.||.||.|
|-
| Std. Dev||.||.||.||.||.||.||.||.||.|
|-
! colspan="10" align="center"| CD loss (nm pr edge)
|-
| Averages||.||.||.||.||.||.||.||.||.|
|-
| Std. Dev||.||.||.||.||.||.||.||.||.|
|-
! colspan="10" align="center"| Bowing (nm)
|-
| Averages||.||.||.||.||.||.||.||.||.|
|-
| Std. Dev||.||.||.||.||.||.||.||.||.|
|-
! colspan="10" align="center"| Bottom curvature
|-
| Averages||.||.||.||.||.||.||.||.||.|
|-
| Std. Dev||.||.||.||.||.||.||.||.||.|
|-
|-
! Images
!       <!-- recipe name -->
|[[Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch/nano10|Images]]
|       <!-- step -->
|[[Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch/nano11|Images]]
|       <!-- chiller temperature -->
|[[Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch/nano12|Images]]
|       <!-- dep time -->
|[[Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch/nano13|Images]]
|       <!-- dep pressure -->
|[[Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch/nano121|Images]]
|       <!-- dep C4F8 flow -->
|[[Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch/nano14|Images]]
|       <!-- dep SF6 flow -->
|[[Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch/nano141|Images]]
|       <!-- dep O2 flow -->
|[[Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch/nano142|Images]]
|       <!-- dep coil power -->
|[[Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch/nano143|Images]]
|       <!-- etch time -->
|       <!-- etch pressure -->
|       <!-- etch C4F8 flow -->
|       <!-- etch SF6 flow -->
|       <!-- etch O2 flow -->
!      <!-- etch coil power -->
|       <!-- etch platen power -->
| LF+B100      <!-- hardware -->
| [[Specific Process Knowledge/Etch/DRIE-Pegasus/nanobosch/nb-1.2 | Click]]
|-
|-
|}
|}