Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch: Difference between revisions
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! Etch | ! Etch | ||
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!Cycle time (secs) | |||
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| 2.5 | |||
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!C<sub>4</sub>F<sub>8</sub> (sccm) | !C<sub>4</sub>F<sub>8</sub> (sccm) | ||
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| colspan="2" align="center"| | | colspan="2" align="center"| | ||
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! Duration | ! Duration | ||
| colspan="2" align="center"| | | colspan="2" align="center"| 60 cyc / 7:30 | ||
| colspan="2" align="center"| | | colspan="2" align="center"| | ||
| colspan="2" align="center"| | | colspan="2" align="center"| | ||
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! colspan="11" align="center"| Etch rates (nm/min) | ! colspan="11" align="center"| Etch rates (nm/min) | ||
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| Averages||.||.||.||.||.||.||.||.||. | | Averages||.||.||.||.||.||.||.||.||.| | ||
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| Std. Dev||.||.||.||.||.||.||.||.||. | | Std. Dev||.||.||.||.||.||.||.||.||.| | ||
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! colspan="10" align="center"| Zep etch rate (nm/min) | ! colspan="10" align="center"| Zep etch rate (nm/min) | ||
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| Averages||.||.||.||.||.||.||.||.||. | | Averages||.||.||.||.||.||.||.||.||.| | ||
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! colspan="10" align="center"| Sidewall angle (degrees) | ! colspan="10" align="center"| Sidewall angle (degrees) | ||
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| Averages||.||.||.||.||.||.||.||.||. | | Averages||.||.||.||.||.||.||.||.||.| | ||
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| Std. Dev||.||.||.||.||.||.||.||.||. | | Std. Dev||.||.||.||.||.||.||.||.||.| | ||
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! colspan="10" align="center"| CD loss (nm pr edge) | ! colspan="10" align="center"| CD loss (nm pr edge) | ||
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| Averages||.||.||.||.||.||.||.||.||. | | Averages||.||.||.||.||.||.||.||.||.| | ||
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| Std. Dev||.||.||.||.||.||.||.||.||. | | Std. Dev||.||.||.||.||.||.||.||.||.| | ||
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! colspan="10" align="center"| Bowing (nm) | ! colspan="10" align="center"| Bowing (nm) | ||
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| Averages||.||.||.||.||.||.||.||.||. | | Averages||.||.||.||.||.||.||.||.||.| | ||
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| Std. Dev||.||.||.||.||.||.||.||.||. | | Std. Dev||.||.||.||.||.||.||.||.||.| | ||
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! colspan="10" align="center"| Bottom curvature | ! colspan="10" align="center"| Bottom curvature | ||
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| Averages||.||.||.||.||.||.||.||.||. | | Averages||.||.||.||.||.||.||.||.||.| | ||
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| Std. Dev||.||.||.||.||.||.||.||.||. | | Std. Dev||.||.||.||.||.||.||.||.||.| | ||
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! Images | ! Images |
Revision as of 08:29, 17 September 2012
Development of continuous nanoetch
Recipe | nano1.0 | nano1.1 | nano1.2 | nano1.3 | nano1.21 | nano1.4 | nano1.41 | nano1.42 | nano1.43 |
---|---|---|---|---|---|---|---|---|---|
C4F8 (sccm) | 52 | 52 | 52 | 52 | 75 | 75 | 75 | 75 | 75 |
SF6 (sccm) | 38 | 38 | 38 | 38 | 38 | 38 | 38 | 38 | 38 |
O2 (sccm) | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 |
Coil power (W) | 800 (F) | 600 (F) | 800 (F) | 600 (F) | 800 (F) | 800 (F) | 800 (F) | 800 (F) | 800 (F) |
Platen power (W) | 50 | 50 | 50 | 40 | 50 | 50 | 75 | 40 | 30 |
Pressure (mtorr) | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
Temperature (degs C) | 10 | 10 | -10 | -10 | -10 | -20 | -20 | -20 | -20 |
Process time (s) | 120 | 120 | 120 | 120 | 120 | 120 | 120 | 120 | 120 |
Etch rates (nm/min) | |||||||||
Averages | 295 | 228 | 299 | 235 | 183 | 183 | 166 | 160 | 148 |
Std. Dev | 36 | 29 | 37 | 20 | 9 | 9 | 9 | 8 | 6 |
Zep etch rate (nm/min) | |||||||||
172 | 95 | 94 | 69 | 67 | 101 | 65 | 55 | ||
Sidewall angle (degrees) | |||||||||
Averages | 93 | 94 | 92 | 94 | 91 | 91 | 90 | 90 | 90 |
Std. Dev | 1 | 1 | 0 | 1 | 0 | 0 | 1 | 0 | 0 |
CD loss (nm pr edge) | |||||||||
Averages | -11 | -13 | -17 | -10 | -10 | -10 | -20 | -13 | -24 |
Std. Dev | 12 | 10 | 11 | 14 | 15 | 15 | 16 | 15 | 21 |
Bowing (nm) | |||||||||
Averages | 31 | 42 | 13 | 16 | 6 | 6 | 3 | -3 | 0 |
Std. Dev | 7 | 6 | 4 | 3 | 2 | 2 | 2 | 3 | 1 |
Bottom curvature | |||||||||
Averages | -45 | -45 | -44 | -43 | -32 | -32 | -34 | -32 | -39 |
Std. Dev | 5 | 7 | 4 | 9 | 10 | 10 | 9 | 8 | 9 |
Images | Images | Images | Images | Images | Images | Images | Images | Images | Images |
Development of switched nanoetch process
On the basis of the pxnano2 recipe from the ASE we will try to make a similar Bosch process on the Pegasus. The substrates are 6" wafers with
Recipe | Nanobosch1 | Nanobosch2 | Nanobosch3 | Nanobosch4 | Nanobosch5 | |||||
---|---|---|---|---|---|---|---|---|---|---|
Cycle | Etch | Dep | Etch | Dep | Etch | Dep | Etch | Dep | Etch | Dep |
Cycle time (secs) | 5 | 2.5 | ||||||||
C4F8 (sccm) | 50 | 50 | ||||||||
SF6 (sccm) | 50 | 0 | ||||||||
O2 (sccm) | 5 | 0 | ||||||||
Coil power (W) | 350 | 500 | ||||||||
Platen power (W) | 30 | 0 | ||||||||
Pressure (mtorr) | 10 | 10 | ||||||||
Temperature (degs C) | 20 | |||||||||
Duration | 60 cyc / 7:30 | |||||||||
Etch rates (nm/min) | ||||||||||
Averages | . | . | . | . | . | . | . | . | ||
Std. Dev | . | . | . | . | . | . | . | . | ||
Zep etch rate (nm/min) | ||||||||||
Averages | . | . | . | . | . | . | . | . | ||
Sidewall angle (degrees) | ||||||||||
Averages | . | . | . | . | . | . | . | . | ||
Std. Dev | . | . | . | . | . | . | . | . | ||
CD loss (nm pr edge) | ||||||||||
Averages | . | . | . | . | . | . | . | . | ||
Std. Dev | . | . | . | . | . | . | . | . | ||
Bowing (nm) | ||||||||||
Averages | . | . | . | . | . | . | . | . | ||
Std. Dev | . | . | . | . | . | . | . | . | ||
Bottom curvature | ||||||||||
Averages | . | . | . | . | . | . | . | . | ||
Std. Dev | . | . | . | . | . | . | . | . | ||
Images | Images | Images | Images | Images | Images | Images | Images | Images | Images |