Specific Process Knowledge/Characterization/Profiler/Optical Profiler (Sensofar) acceptance test: Difference between revisions

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===Results of acceptance test no. 1, 2 and 3===
===Results of acceptance test no. 1, 2 and 3===
Sample material: Patterned silicon substrate
Sample material: Patterned silicon substrate
Measurement: Trench depth with aspect ratio 1:10, 1:11 and 1:13 on a 10µm, 8mm and 6µm wide trenches respectively
Measurement: Trench depth with aspect ratio 1:10, 1:11 and 1:13 on a 10µm, 8mm and 6.4µm wide trenches respectively
Acceptance criteria:Depth 100±2 µm, 91±2µm and 85±2µm
Acceptance criteria:Depth 100±2 µm, 91±2µm and 85±2µm



Revision as of 11:00, 23 August 2012

Results from the Optical Profiler (Sensofar) acceptance test

The acceptance test was performed in January 2012 by STInstruments and Sensofar together with Pernille V. Larsen @ Danchip and Berit G. Herstrøm @ Danchip.

This Table shows the accpetance criteria

' Title Sample description / measurement Acceptance criteria
1 Patterned flat sample of silicon Sample material: Patterned silicon substrate. Depth 100±2 µm
Trench depth with aspect ratio 1:10 on a 10 µm wide trench
2 Patterned flat sample of silicon. Sample material: Patterned silicon substrate. Depth 91±2 µm
Trench depth with aspect ratio 1:11 on a 8 µm wide trench
3 Patterned flat sample of silicon Sample material: Patterned silicon substrate Depth 85±2 µm
Trench depth with aspect ratio 1:13 on a 6.4 µm wide trench
4 Patterned flat sample of glass 3D profile of pattern etched down in a quartz sample. Depth within ±1% from a standard profiler measurement and repeatability (3 successive measurements) within 0.1%
Pattern size 20 µm x 20 µm, depth 500 nm
5 Flat sample of silicon with thick patterned oxide Step height of patterned thick (10 µm) oxide on top of a silicon wafer. Step height must be within ±3% of a SEM profile measurement.
7 µm deep pattern, trench width 6 µm
6 Flat sample of silicon with thick layer of patterned polymer Sample material: SU8 on silicon. Height 69±2 µm
Pillar heights of 69 µm with 25 µm between pillar edges
7 Free standing structure Measure bow due to stress of a membrane. Membrane bow repeatability of 5 successive measurement within 2%
Membrane material: Si(2 µm)/SiO2(~1 µm)/Au(50 nm).
Membrane size: honey comb structure approximately 150 µm in diameter.
Bow < 500 nm
8 Stitching of large area Stitching 4 mm x 4 mm on same sample as in 7. The area consists of many closed packed honey comb formed membranes. Membrane bow must the same as on 7 within 2%
9 Narrow trenches and holes Sample material: Patterned silicon substrate. Depth 20±2 µm
2.5 µm wide trench in silicon with a depth of 20 µm
10 Film thickness measurement of transparent thin film Transparent thin film thickness of 28 nm SiO2 on Si SiO2 thickness 28±1 nm
11 Measurements of multiple stacks 120 nm nitride on 110 nm oxide on a silicon substrate Within ±2% on each layer from an ellipsometer measurement.
12 Film thickness measurements of transparent films on small structure Sample material: Si with 1.5 µm patterned AZ-resist Within ±1% from a standard profiler measurement.
Measure thickness of AZ-resist on pillars of 50 µm in diameter
13 Roughness repeatability Sample material: Si wafer with poly-silicon layer. Repeatability within 0.2%
3 successive measurements of the roughness

Results

Results of acceptance test no. 1, 2 and 3

Sample material: Patterned silicon substrate Measurement: Trench depth with aspect ratio 1:10, 1:11 and 1:13 on a 10µm, 8mm and 6.4µm wide trenches respectively Acceptance criteria:Depth 100±2 µm, 91±2µm and 85±2µm

It was done in two ways:

  1. With confocal objective EPI 100x-N: See the results here
  2. With Interferometric objective 50X DI: See the results here

Setting for methode no. 1: confocal

Recipe: Trench

  • Operation mode: trench
    • + Raw smoothing confocal
    • + fine shift
  • Objective: EPI 100X-N
  • Z scan
    • Dual - bottom up
      • top: 8µm
      • Gap: 91µm
      • Bottom: 8µm
    • Speed factor: 1x
    • + Linear stage
  • Threshold: 0.0%
  • Light source
    • Levels: 2
      • 900 -> 60
      • Gain: default

Setting for methode no. 2: interferometric

We do not have a recipe for that but we used:

  • Objective: Interferometric 50x DI
  • Z scan: VSI
  • Light souce: increased gain and contrast

Results of acceptance test no. 4

Sample material: Patterned fused silica.

Measurement: Depth of pattern

Acceptance criteria:Depth within ±1% from a standard profiler measurement and repeatability (3 successive measurements) within 0.1%

Standard profiler measurement:

It was done using interferometric measurements: Objective: DI 50x-N VSI z scan: 10µm Treshold: 1%

Results: It was repeated 10 Time The first measurement is shown here: