Specific Process Knowledge/Thin film deposition/Si sputter in Wordentec: Difference between revisions
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== Silicon sputter== | == Silicon sputter== | ||
Silicon can be deposited in [[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec.]] | Silicon can be sputter deposited in [[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec.]] | ||
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Please don´t use higher power then 180W, since the target then could | Please don´t use higher power then 180W, since the target then could break into a lot of small pieces. | ||
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Revision as of 08:07, 2 April 2014
Silicon sputter
Silicon can be sputter deposited in Wordentec.
Parameters
Listed below are tried parameters, that can be used during deposition. Use the rates as a start value, and make a test to be sure that you get the right thickness.
Please don´t use higher power then 180W, since the target then could break into a lot of small pieces.
| Settings 1 | Settings 2 | |
|---|---|---|
| Process type | Sputtering | Sputtering |
| Power | 130W | 170W |
| Sputter pressure | 5*10-3 | 1*10-2 |
| Rate | About 0,7 Å/s | About 0,6 Å/s |