Specific Process Knowledge/Thin film deposition/Si sputter in Wordentec: Difference between revisions
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| Sputter pressure | | Sputter pressure | ||
| 5*10<sup>-2</sup> | | 5*10<sup>-2</sup> | ||
| | | 1*10<sup>-2</sup> | ||
|- | |- | ||
| Rate | | Rate | ||
| About 0, | | About 0,7Å/s | ||
| About 0,6Å/s | | About 0,6Å/s | ||
|- | |- | ||
|} | |} | ||