Specific Process Knowledge/Thin film deposition/Si sputter in Wordentec: Difference between revisions

Revision as of 15:17, 15 August 2012 view source Kn (talk \| contribs) danchip 979 edits No edit summary ← Older edit		Revision as of 15:18, 15 August 2012 view source Kn (talk \| contribs) danchip 979 edits No edit summary Newer edit →
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	'''Parameters'''		'''Parameters'''

	Listed below are tried parameters, that can be used during deposition.		Listed below are tried parameters, that can be used during deposition. Use the rates as a start value, and make a test to be sure that you get the right thickness.