Specific Process Knowledge/Thin film deposition/Si sputter in Wordentec: Difference between revisions

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'''Parameters'''
'''Parameters'''


Listed below are tried parameters, that can be used during deposition.
Listed below are tried parameters, that can be used during deposition. Use the rates as a start value, and make a test to be sure that you get the right thickness.





Revision as of 14:18, 15 August 2012

Silicon sputter

Silicon can be deposited in Wordentec.


Parameters

Listed below are tried parameters, that can be used during deposition. Use the rates as a start value, and make a test to be sure that you get the right thickness.


Please don´t use higher power then 180W, since the target then could breake into a lot of small pieces.

Settings 1 Settings 2
Process type Sputtering Sputtering
Power 130W 170W
Sputter pressure 5*10-2 5*10-2
Rate About 0,6Å/s About 0,6Å/s