Specific Process Knowledge/Characterization/Profiler/Optical Profiler (Sensofar) acceptance test: Difference between revisions

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Pernille V. Larsen @ Danchip and Berit G. Herstrøm @ Danchip.
Pernille V. Larsen @ Danchip and Berit G. Herstrøm @ Danchip.


{| {{table}}
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| align="center" style="background:#f0f0f0;"|''''''
| align="center" style="background:#f0f0f0;"|''''''
| align="center" style="background:#f0f0f0;"|'''Title'''
| align="center" style="background:#f0f0f0;"|'''Title'''
| align="center" style="background:#f0f0f0;"|'''Sample description / measurement'''
| align="center" style="background:#f0f0f0;"|'''Sample description / measurement'''
| align="center" style="background:#f0f0f0;"|'''Acceptance criteria'''
| align="center" style="background:#f0f0f0;"|'''Acceptance criteria'''
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| 1||Patterned flat sample of silicon||Sample material: Patterned silicon substrate.||Depth 100±2 µm
| 1||Patterned flat sample of silicon||Sample material: Patterned silicon substrate.||Depth 100±2 µm
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| ||||Pattern size 20 µm x 20 µm, depth 500 nm||
| ||||Pattern size 20 µm x 20 µm, depth 500 nm||
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| 5||Flat sample of silicon with thick patterned oxide||Step height of patterned thick (10 µm) oxide on top of a silicon wafer.||Step height must be within ±3% of a SEM profile measurement.
| 5||Flat sample of silicon with thick patterned oxide||Step height of patterned thick (10 µm) oxide on top of a silicon wafer.||Step height must be within ±3% of a SEM profile measurement.
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| 8||Stitching of large area||Stitching 4 mm x 4 mm on same sample as in 7. The area consists of many closed packed honey comb formed membranes.||Membrane bow must the same as on 7 within 2%
| 8||Stitching of large area||Stitching 4 mm x 4 mm on same sample as in 7. The area consists of many closed packed honey comb formed membranes.||Membrane bow must the same as on 7 within 2%
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| 9||Narrow trenches and holes ||Sample material: Patterned silicon substrate.||Depth 20±2 µm
| 9||Narrow trenches and holes ||Sample material: Patterned silicon substrate.||Depth 20±2 µm
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| 10||Film thickness measurement of transparent thin film||Transparent thin film thickness of 28 nm SiO2 on Si||SiO2 thickness 28±1 nm  
| 10||Film thickness measurement of transparent thin film||Transparent thin film thickness of 28 nm SiO2 on Si||SiO2 thickness 28±1 nm  
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| 11||Measurements of multiple stacks||120 nm nitride on 110 nm oxide on a silicon substrate||Within ±2% on each layer from an ellipsometer measurement.  
| 11||Measurements of multiple stacks||120 nm nitride on 110 nm oxide on a silicon substrate||Within ±2% on each layer from an ellipsometer measurement.  
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| 12||Film thickness measurements of transparent films on small structure||Sample material: Si with 1.5 µm patterned AZ-resist||Within ±1% from a standard profiler measurement.
| 12||Film thickness measurements of transparent films on small structure||Sample material: Si with 1.5 µm patterned AZ-resist||Within ±1% from a standard profiler measurement.
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| ||||3 successive measurements of the roughness ||
| ||||3 successive measurements of the roughness ||
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Revision as of 09:18, 3 August 2012

Results from the Optical Profiler (Sensofar) acceptance test

The acceptance test was performed in January 2012 by STInstruments and Sensofar together with Pernille V. Larsen @ Danchip and Berit G. Herstrøm @ Danchip.

' Title Sample description / measurement Acceptance criteria
1 Patterned flat sample of silicon Sample material: Patterned silicon substrate. Depth 100±2 µm
Trench depth with aspect ratio 1:10 on a 10 µm wide trench
2 Patterned flat sample of silicon. Sample material: Patterned silicon substrate. Depth 91±2 µm
Trench depth with aspect ratio 1:11 on a 8 µm wide trench
3 Patterned flat sample of silicon Sample material: Patterned silicon substrate Depth 85±2 µm
Trench depth with aspect ratio 1:13 on a 6.4 µm wide trench
4 Patterned flat sample of glass 3D profile of pattern etched down in a quartz sample. Depth within ±1% from a standard profiler measurement and repeatability (3 successive measurements) within 0.1%
Pattern size 20 µm x 20 µm, depth 500 nm
5 Flat sample of silicon with thick patterned oxide Step height of patterned thick (10 µm) oxide on top of a silicon wafer. Step height must be within ±3% of a SEM profile measurement.
7 µm deep pattern, trench width 6 µm
6 Flat sample of silicon with thick layer of patterned polymer Sample material: SU8 on silicon. Height 69±2 µm
Pillar heights of 69 µm with 25 µm between pillar edges
7 Free standing structure Measure bow due to stress of a membrane. Membrane bow repeatability of 5 successive measurement within 2%
Membrane material: Si(2 µm)/SiO2(~1 µm)/Au(50 nm).
Membrane size: honey comb structure approximately 150 µm in diameter.
Bow < 500 nm
8 Stitching of large area Stitching 4 mm x 4 mm on same sample as in 7. The area consists of many closed packed honey comb formed membranes. Membrane bow must the same as on 7 within 2%
9 Narrow trenches and holes Sample material: Patterned silicon substrate. Depth 20±2 µm
2.5 µm wide trench in silicon with a depth of 20 µm
10 Film thickness measurement of transparent thin film Transparent thin film thickness of 28 nm SiO2 on Si SiO2 thickness 28±1 nm
11 Measurements of multiple stacks 120 nm nitride on 110 nm oxide on a silicon substrate Within ±2% on each layer from an ellipsometer measurement.
12 Film thickness measurements of transparent films on small structure Sample material: Si with 1.5 µm patterned AZ-resist Within ±1% from a standard profiler measurement.
Measure thickness of AZ-resist on pillars of 50 µm in diameter
13 Roughness repeatability Sample material: Si wafer with poly-silicon layer. Repeatability within 0.2%
3 successive measurements of the roughness