Specific Process Knowledge/Characterization/Profiler/Optical Profiler (Sensofar) acceptance test: Difference between revisions
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Pernille V. Larsen @ Danchip and Berit G. Herstrøm @ Danchip. | Pernille V. Larsen @ Danchip and Berit G. Herstrøm @ Danchip. | ||
{| {{table} | {| {{table} border="1" | ||
| align="center" style="background:#f0f0f0;"|'''''' | | align="center" style="background:#f0f0f0;"|'''''' | ||
| align="center" style="background:#f0f0f0;"|'''Title''' | | align="center" style="background:#f0f0f0;"|'''Title''' | ||
| align="center" style="background:#f0f0f0;"|'''Sample description / measurement''' | | align="center" style="background:#f0f0f0;"|'''Sample description / measurement''' | ||
| align="center" style="background:#f0f0f0;"|'''Acceptance criteria''' | | align="center" style="background:#f0f0f0;"|'''Acceptance criteria''' | ||
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| 1||Patterned flat sample of silicon||Sample material: Patterned silicon substrate.||Depth 100±2 µm | | 1||Patterned flat sample of silicon||Sample material: Patterned silicon substrate.||Depth 100±2 µm | ||
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| ||||Pattern size 20 µm x 20 µm, depth 500 nm|| | | ||||Pattern size 20 µm x 20 µm, depth 500 nm|| | ||
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| 5||Flat sample of silicon with thick patterned oxide||Step height of patterned thick (10 µm) oxide on top of a silicon wafer.||Step height must be within ±3% of a SEM profile measurement. | | 5||Flat sample of silicon with thick patterned oxide||Step height of patterned thick (10 µm) oxide on top of a silicon wafer.||Step height must be within ±3% of a SEM profile measurement. | ||
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| 8||Stitching of large area||Stitching 4 mm x 4 mm on same sample as in 7. The area consists of many closed packed honey comb formed membranes.||Membrane bow must the same as on 7 within 2% | | 8||Stitching of large area||Stitching 4 mm x 4 mm on same sample as in 7. The area consists of many closed packed honey comb formed membranes.||Membrane bow must the same as on 7 within 2% | ||
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| 9||Narrow trenches and holes ||Sample material: Patterned silicon substrate.||Depth 20±2 µm | | 9||Narrow trenches and holes ||Sample material: Patterned silicon substrate.||Depth 20±2 µm | ||
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| 10||Film thickness measurement of transparent thin film||Transparent thin film thickness of 28 nm SiO2 on Si||SiO2 thickness 28±1 nm | | 10||Film thickness measurement of transparent thin film||Transparent thin film thickness of 28 nm SiO2 on Si||SiO2 thickness 28±1 nm | ||
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| 11||Measurements of multiple stacks||120 nm nitride on 110 nm oxide on a silicon substrate||Within ±2% on each layer from an ellipsometer measurement. | | 11||Measurements of multiple stacks||120 nm nitride on 110 nm oxide on a silicon substrate||Within ±2% on each layer from an ellipsometer measurement. | ||
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| 12||Film thickness measurements of transparent films on small structure||Sample material: Si with 1.5 µm patterned AZ-resist||Within ±1% from a standard profiler measurement. | | 12||Film thickness measurements of transparent films on small structure||Sample material: Si with 1.5 µm patterned AZ-resist||Within ±1% from a standard profiler measurement. | ||
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| ||||3 successive measurements of the roughness || | | ||||3 successive measurements of the roughness || | ||
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