Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300/IBE Si etch: Difference between revisions
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Best recipe with respect to the etch profile and low redeposition: | Best recipe with respect to the etch profile and low redeposition: | ||
Revision as of 11:58, 31 July 2012
Results for Si etching in the IBE
Best recipe with respect to the etch profile and low redeposition:
| Parameter | Best Si etching recipe so fare |
|---|---|
| Neutalizer current [mA] | 450 |
| RF Power [W] | 1200 |
| Beam current [mA] | 400 |
| Beam voltage [V] | 400 |
| Beam accelerator voltage | 400 |
| Ar flow to neutralizer [sccm] | 6.0 |
| Ar flow to beam [sccm] | 6.0 |
| Rotation speed [rpm] | 20 |
| Stage angle [degrees] | 10 |
| Results | vvv |
| Etch rate [nm/min] | 15-30? |