Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300/IBE process trends: Difference between revisions
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==Rotation speed== | |||
The rotation is activated to get a good uniformity over the wafer. The minimum number of rotation to get a good uniformity is 100 rotation for the hole etch. the maximum rotation speed is 20rpm. That means that an etch shorter that 5min cannot obtain a very good uniformity. | |||
{| border="2" cellspacing="2" cellpadding="3" | |||
!Etch Length [min] | |||
!5 | |||
!6 | |||
!7 | |||
!8 | |||
!9 | |||
!10 | |||
!15 | |||
!20 | |||
!25 | |||
!34 | |||
!50 | |||
!100 | |||
|- | |||
|Minimum rotation speed [rpm] | |||
|20 | |||
|17 | |||
|15 | |||
|13 | |||
|12 | |||
|10 | |||
|7 | |||
|5 | |||
|4 | |||
|3 | |||
|2 | |||
|1 | |||
|- | |- | ||